Void Detection for TSV and 3DIC Plug Fill. Metryx Mass Metrology

Metryx LtD (Bristol, UK)  has demonstrated ability to detect voids in Cu plating for TSV structures utilizing unique mass measurement technology.  It was found that liquid residue from plating process in the structures was released during the Cu anneal.  The differences in mass post anneal clearly identified which wafers had voids.   This on-product measurement can be done on every wafer at a rate of 60 wafers/hour.  It will identify which wafer has the void and there are no false flags.

“In a field of haystacks, this tool will identify which haystack has the needle.”

Contact Dynaxa LLC (203)-300-5237 or info@DynaxaLLC.com for additional information.

TSV voids detection

Difference in mass isolates wafer with voids in fill